Method and apparatus for die testing on wafer

ABSTRACT

An integrated circuit includes switching means for selectively connecting the bond pads to functional core logic and isolating the bond pads from second conductors, and the switch means for selectively connecting the bond pads to the second conductors to provide bi-directional connections between the bond pads on opposite sides of the substrate and isolating the bond pads from the functional core logic.

This application is a divisional of prior application Ser. No.11/214,088, filed Aug. 29, 2005, now pending;

-   which was a divisional of prior application Ser. No. 10/832,919,    filed Apr. 26, 2004; now U.S. Pat. No. 6,954,080, issued Oct. 11,    2005;-   which was a divisional of prior application Ser. No. 09/835,802,    filed Apr. 16, 2001, now U.S. Pat. No. 6,727,722, issued Apr. 27,    2004;-   which was a divisional of prior application Ser. No. 09/325,487,    filed Jun. 3, 1999, now U.S. Pat. No. 6,262,587, issued Jul. 17,    2001;-   which was a divisional of prior application Ser. No. 08/742,189,    filed Oct. 31, 1996, now U.S. Pat. No. 5,969,538, issued Oct. 19,    1999.

FIELD OF THE INVENTION

The invention relates generally to integrated circuit manufacturing and,more particularly, to testing die on wafer.

BACKGROUND OF THE INVENTION

Integrated circuit (ICs) manufacturers produce die on typically circularsubstrates referred to as wafers. A wafer may contain hundreds ofindividual rectangular or square die. Die on wafer, or unsingulated die,must be tested to determine good from bad before the dies aresingulated. Unsingulated die testing traditionally occurs by physicallyprobing each die at the die pads, which allows a tester connected to theprobe to determine good or bad die. This type of probing is relativelyslow and requires expensive mechanical mechanisms to accurately step andposition the probe at each die location on the wafer. The probing stepcan damage the die pads which may interfere with the bonding processduring IC packaging or assembly of bare die on MCM substrates. Also, asdie sizes shrink, pads are positioned closer and closer together and itbecomes more difficult and costly to design precision probinginstruments to access them.

Alternate conventional methods for testing unsingulated die on wafersinclude: (1) designing each die to test itself using built-in-self-test(BIST) circuitry on each die and providing a way to enable each die BISTcircuitry to test the die, (2) widening the scribe lanes between the dieto allow for: (a) test probe points, (b) test access conductors, and/or(c) test circuitry, and (3) processing an overlying layer ofsemiconductor material with test circuitry over the die on wafers andproviding via connections, from the overlying layer, to the pads of eachdie on the wafer. Method 1 disadvantageously requires BIST circuitry onthe die which takes up area, and the BIST circuitry may not be able toadequately test the I/O of the die. Method 2 disadvantageously reducesthe number of die that can be produced on a wafer since the widening ofthe scribe lanes takes up wafer area which could be used for additionaldie. Method 3 disadvantageously requires additional wafer processingsteps to form the overlying test connectivity layer on top of the die onwafers, and also the overlying layer needs to be removed from the waferafter testing is complete. This overlying layer removal step is additivein the process and the underlying die could be damaged during theremoval step.

Ideally, only good die are singulated and packaged into ICs. The cost ofpackaging die is expensive and therefore the packaging of bad die intoICs increases the manufacturing cost of the IC vendor and results in ahigher cost to the consumer.

FIG. 1 illustrates a schematic of a die containing functional core logic(FCL) and input and output buffering to pad locations. The variety ofpad buffering shown includes: inputs (I), 2-state outputs (2SO), 3-stateoutputs (3SO), open drain outputs (ODO), input and 3SO bidirectionals(I/O1), and input and ODO bidirectionals (I/O2). The FCL could be acustom or semicustom (ASIC) implementation comprising: microprocessors,combinational logic, sequential logic, analog, mixed signal,programmable logic, RAMs, ROMs, Caches, Arrays, DSPs, or combinations ofthese and/or other functions. The die is shown having a top side A,right side B, bottom side C, and left side D for convenience ofdescription in regard to its position on the wafer. The die also has atleast one voltage supply (V) pad and at least one ground (G) pad forsupplying power to the die. Side A has pad locations 1-7, B has padlocations 1-8, C has pad locations 1-8, and D has pad locations 1-9. Thearrangement of the buffer/pad combinations on each side (A, B, C, D)corresponds to the desired pinout of the package that the die will beassembled into, or to signal terminals on a multi-chip module (MCM)substrate onto which the die will be connected. FIG. 2 is a cutaway sideview of the die showing an input pad at D2 and an output pad at B2 bothconnected to the FCL.

FIG. 3A shows an example wafer containing 64 of the die of FIG. 1. FIG.3B shows the position of each die on the wafer with respect to sides A,D, C, and D. The phantom die in dotted line shows how the wafer would bepacked to yield more die per wafer. Notice that even when the die istightly packed on the wafer (i.e. the phantom die locations utilized),there is still area at the periphery of the wafer where die cannot beplaced. This is due to the circular shape of the wafer versus thesquare/rectangular shape of the die. This unusable peripheral area ofthe wafer can be used to place test points (pads), test circuitry, andconductors for routing test signals and power and ground to die.

FIG. 4 shows how conventional die testing is performed using a testerand pad probe assembly. The probe assembly is positioned over a selecteddie and lowered to make contact with the die pads. Once contact is madethe tester applies power and checks for high current. If current is higha short exists on the die and test is aborted and the die is marked(usually by an ink color) as bad. If current is normal, then testingproceeds by applying test patterns to the die and receiving testresponse from the die. If the test fails the die is marked as bad. Ifthe test passes the die is good and not marked, or if marked, markedwith a different ink color. During testing the die current can bemonitored to see if it stays within a specified range during the test.An out of range current may be marked as a high current functionalfailure.

Such conventional wafer testing has several disadvantages. The act ofprobing the die scars the metal die pads. Thus, using physical probing,it is essential that dies be tested only once, since re-probing a die torepeat a test may further damage the pads. Even a single probing of adie may cause enough pad damage to adversely affect subsequent assemblyof the die in IC packages or on MCM substrates. With the extremely smalltarget provided by a die pad, the equipment used for positioning theprobe on a die pad must be designed with great care and is thereforevery expensive to purchase/build and maintain and calibrate. Also thestepping of the probe to each die location on the wafer takes time dueto the three dimensional motions the probe must be moved through toaccess and test each die on the wafer.

It is therefore desirable to test die on wafers without thedisadvantages described above.

The present invention provides: a die framework comprising die residentcircuitry and connections to selectively provide either a bypass modewherein the die has direct pad-to-pad connectivity or a functional modewherein the die has die pad to functional core logic connectivity; afault tolerant circuit and method to select a die on a wafer to beplaced in functional mode while other die remain in bypass mode; amethod and apparatus for (1) electronically selecting one die on a waferto be placed in functional mode for testing while other die on the waferare in bypass mode, (2) testing that selected die, and (3) repeating theelectronic selection and testing steps on other die; and a method andapparatus for (1) electronically selecting a plurality of diagonallypositioned die on the wafer to be placed in functional mode for testingwhile other die on the wafer are in bypass mode, (2) testing theselected group of diagonally positioned die in parallel, and (3)repeating the electronic selection and testing steps on other groups ofdiagonally positioned die.

The present invention provides improved testing of unsingulated die onwafer. The invention provides the following exemplary improvements: (1)electronic selection and testing of unsingulated die on wafer, (2)faster testing of dies on wafer, (3) elimination of expensive, finelydesigned mechanical wafer probes, (4) the ability to at-speed testunsingulated die on wafer. (5) the ability to test a plurality ofunsingulated die in parallel, and (6) the ability to simplify theburn-in testing of unsingulated die.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 diagramatically illustrates the functional core logic, input andoutput pads and pad buffering structures of a conventional integratedcircuit die.

FIG. 2 is a cutaway side view of a portion of the conventional die ofFIG. 1.

FIGS. 3A-3B illustrate the placement and orientation of a plurality ofdie on a conventional wafer.

FIG. 4 illustrates a conventional arrangement for testing die on awafer.

FIG. 5 diagramatically illustrates the functional core logic, input andoutput pads and pad buffering of an exemplary integrated circuit dieaccording to the present invention.

FIG. 6 schematically illustrates pad-to-pad connections that exist inthe die of FIG. 5 when in a bypass mode.

FIGS. 7A-11B are cutaway side views of various portions of the FIG. 5die in both functional and bypass modes.

FIG. 12A illustrates an exemplary embodiment of the input state holderof FIG. 7A.

FIG. 12B illustrates an alternative to the input state holder of FIG.12A.

FIGS. 13A-14B are further cutaway side views similar to FIGS. 7A-11B.

FIGS. 15A-15B illustrate an exemplary arrangement for bussing power andground to each die on a wafer.

FIGS. 16A-16B illustrate an exemplary die selection scheme according tothe present invention.

FIGS. 17A-17B illustrate the operation of the die selectors of FIG. 16A.

FIGS. 18A-18C illustrate the structure and operation of the dieselection scheme of FIG. 16A.

FIGS. 19A-19C illustrate a fault tolerant feature of the die selectionscheme of FIG. 16A.

FIG. 19D illustrates the die selection scheme of FIG. 16A applied to aplurality of die on a plurality of wafers.

FIGS. 20A-20B illustrate another exemplary die selection schemeaccording to the present invention.

FIGS. 21A-21B illustrate the operation of the die selectors of FIG. 20A.

FIGS. 22A-23B illustrate the structure and operation of the dieselection scheme of FIG. 20A.

FIGS. 24A-24C illustrate a fault tolerant feature of the die selectionscheme of FIG. 20A.

FIGS. 24D and 24E diagramatically illustrate an exemplary implementationof the die selector defined in FIGS. 21A-23B.

FIGS. 24F and 24G diagrammatically illustrate an exemplaryimplementation of the die selector defined in FIGS. 17A-18C.

FIGS. 25A-25E illustrate an exemplary arrangement according to thepresent invention for testing die on wafer.

FIG. 26 illustrates a portion of FIG. 25A in greater detail.

FIG. 27 illustrates an exemplary arrangement according to the presentinvention for testing a plurality of die on wafer in parallel.

FIG. 28 illustrates an exemplary power and ground bussing arrangementfor use with the testing arrangement of FIG. 27.

FIG. 29 illustrates an exemplary die selection scheme for use with thetesting arrangement of FIG. 27.

FIG. 30 illustrates a portion of FIG. 27 in greater detail.

FIGS. 31A-310 illustrate a sequence of testing steps supported by thearrangement of FIG. 27, wherein groups of diagonally positioned die aretested in parallel fashion.

DETAILED DESCRIPTION

In FIG. 5 a die schematic similar to that of FIG. 1 is shown. Like FIG.1, the die has sides A, B, C, and D and corresponding pad sites forinput, output, input/output, V and G. FIG. 5 includes additional padsites A8 and B9 referred to as bypass, and an additional pad site C9referred to as mode. The mode pad is buffered like a data input. Whenmode is at a predetermined logic level, say high, the die schematicappears as shown in FIG. 5, and the die is in its functional mode whichis exactly the equivalent of the die in FIG. 1. In functional mode, theFCL, input, output, and input/output pads are enabled and the dieperforms its intended function. In functional mode, the bypass pads arenot used.

In exemplary FIG. 6, the die of FIG. 5 is schematically shown as itwould operate in the bypass mode of the present invention. The die isplaced in bypass mode by taking the mode pad to a logic state oppositethat of the functional mode logic state, in this case a logic low. Inbypass mode, the die's FCL, input, output, and input/output buffers aredisabled and pad sites of corresponding position between sides A and Cand between sides D and B are electrically connected. In bypass mode thedie is transformed into a simple interconnect structure between sides Aand C and between sides D and B. The interconnect structure includes aplurality of conductors extending parallel to one another between sidesA and C, and a further plurality of conductors extending parallel to oneanother between sides D and B. While in bypass mode, signals from atester apparatus can flow through the interconnects between A and C andbetween D and B to access and test a selected die on a wafer.

While most bypass connections can be made between existing functionallyrequired pad sites, the number of functional pad sites on one side maynot equal the number of functional pad sites on the opposite side. Thusthe bypass pads of FIG. 5 provide pad-to-pad connectivity when thenumber of pads on opposite sides are not equal. For example, in FIGS. 5and 6, bypass pads A8 and B9 provide connecting pads for functional padsC8 and D9 respectively. The bypass connections between opposite side diepads form a low impedance, bidirectional signaling path through the diefrom pad to pad. The bypass connections between two sides are preferablydesigned to have an equal propagation delay between opposite side padsto avoid skewing of test signals passed through bypassed die.

Assuming for example the die positioning shown on the wafer of FIG. 3A,the sides of a die selected for testing need to be driven by signalsfrom the adjacent sides of top, right, bottom, and left neighboring diewhich are in bypass mode (FIG. 6). In order for the neighboring die tobe tested, it is placed in functional mode, and: (1) all signalsrequired at its A side are provided at the C side of the top neighboringbypassed die, (2) all signals required at its B side are provided at theD side of the right neighboring bypassed die, (3) all signals requiredat its C side are provided at the A side of the bottom neighboringbypassed die, and (4) all signals required at its D side are provided atthe B side of the left neighboring bypassed die.

FIGS. 7 through 14 depict cross section views of example circuitry andconnections which can achieve the framework for selective die functionaland bypass modes.

Exemplary FIGS. 7A and 7B illustrate side views of the D1 input pad andthe B1 3-state output pad of the die in FIGS. 5 and 6. A switch 71 isprovided between the input pad and input buffer to allow isolating theinput pad from the input buffer during bypass mode, and an input stateholder (ISH) circuit is provided between the switch and input buffer toallow holding a predetermined input state to the input buffer (whichdrives the FCL) while the switch is open during bypass mode. Gatingcircuitry, such as an AND gate (A), is provided in the control pathbetween the FCL and 3-state output buffer to allow the 3-state outputbuffer to be disabled during bypass mode. A selectable connection path73 between the input and output pad includes a conductor 75 connectedbetween a switch 77 associated with the input pad and a switch 79associated with the output pad, which switches are operable to connectconductor 75 to G or to the input and output pads. The mode pad isconnected to the switches. ISH and gate A as shown such that when themode pad is in one logic state the die is in functional mode and when inthe opposite logic state the die is in bypass mode. The mode pad can beconnected to FCL as shown to permit disabling of clocks or otheroperations in FCL during bypass mode.

As shown in exemplary FIG. 12A, ISH can be realized with a 3-state databuffer having a data input connected to a desired logic level (logic “1”in this example) and a data output connected to the input of the inputbuffer and a 3-state control input connected to the mode pad. Thedesired logic level for a given FCL input could be, for example, a logiclevel which minimizes current flow in the FCL during bypass mode. The3-state buffer is enabled during bypass mode and 3-stated duringfunctional mode. If the desired logic level is a don't care condition,then the bus holder BH of exemplary FIG. 12B can be used to hold thelast input logic level during bypass mode.

When in functional mode (FIG. 7A), the switches 77 and 79 connect theconductor 75 to G which provides a ground plane on the conductor andprevents AC coupling between the input and output pads. When in bypassmode (FIG. 7B), the switches 77 and 79 and the conductor 75 provide alow impedance, bidirectional signaling path connection between the inputand output pads. In bypass mode, switch 71 is open to isolate FCL fromthe input pad, and the 3-state output buffer is disabled (3-stated) viaAND gate A to isolate FCL from the output pad.

The examples of FIGS. 8-11 show the use of the bypass circuitry withother types of pad buffers. FIGS. 13 and 14 show the use of the bypasscircuitry between functional input (D9) and bypass (B9) pads, andfunctional output (C8) and bypass (A8) pads.

In FIGS. 8A and 8B, a further switch 81 is used to isolate the 2-stateoutput buffer from output pad B2 during bypass mode. FIGS. 8C and 8D aresimilar to FIGS. 8A and 8B except a 3-state output buffer is usedinstead of a 2-state output buffer and switch 81, in order to eliminatethe impedance of switch 81 during functional mode.

The input pads in FIGS. 9A and 9B and the 3-state output pads in FIGS.10A and 10B are arranged in the manner described above with respect toFIGS. 7A and 7B.

FIGS. 11A and 11B illustrate I/O pads with 3-state (I/O1) and open drain(I/O2) outputs. The input buffers and the 3-state output buffer of FIGS.11A and 11B are arranged as described above with respect to FIGS. 7A and7B. The open drain output buffer of FIGS. 11A and 11B has its inputconnected to an output of an OR gate (O) which has one input driven byFCL and another input driven by the logical inverse of the mode signal,whereby the open drain output will float high during bypass modeassuming that the mode signal selects bypass mode when low.

The input pad in FIGS. 13A and 13B, and the 3-state output pad in FIGS.14A and 14B are arranged in the manner described above with respect toFIGS. 7A and 7B.

FIG. 15A illustrates an example of how wafer voltage (WV) and waferground (WG) bussing can be distributed to the V and G pads of each dieon the wafer. The WV bussing is shown originating from areas of thewafer designated as probe area PA1 and probe area PA2. The WG bussing isshown originating from probe area PA3 and probe area PA4. Probe areasPA1-4 are positioned at the periphery of the wafer and in areas wheredie cannot be placed, as mentioned in regard to FIG. 3A. FIG. 15Billustrates how WV and WG are coupled to the V and G die pads (see FIGS.1 and 5) through diodes. By placing diodes between WG and G and WV andV, conventional localized probing and power up of an individual die canoccur without powering up neighboring dies.

FIG. 16A illustrates an exemplary scheme for performing fault tolerantselection of unsingulated die on wafer. The scheme involves theplacement of a small circuit, referred to as a die selector 161, in thescribe lane adjacent each die on the wafer. The die selector 161 shownin FIG. 16B includes an I/O terminal S1, an I/O terminal S2, a modeoutput terminal, and connections to WV and WG for power. The dieselector's mode output is connected to the mode pad of an associateddie. The die selectors are connected in series via their S1 and S2terminals. In the example of FIG. 16A, S1 of the first die selector inthe series (at die 1) is connected to PA4, and S2 of the last dieselector in the series (at die 64) is connected to PA3. Because the dieselector is placed in the scribe lane instead of on the die, the modepad of the die can be physically probed if required, to override the dieselector mode output. This feature permits any die to be tested usingthe conventional probe testing technique. Because the mode output of thedie selector drives only the mode pad of a single die, it can bedesigned with a relatively weak output drive so that the conventionalprobe tester can easily override the mode output without any damage tothe mode output.

Power is applied to WV and WG by probing PA1-PA4. When power is firstapplied, all the die selectors get reset to a state that forces theirmode outputs low, which causes all die to be placed in bypass mode. Ifexcess current is detected at power up (indicating perhaps a shortbetween WV and WG), the wafer can be powered down and tested using thetraditional mechanical probing technique (note that the diodes of FIG.15B allow for this). If normal current is detected (meaning that all diehave successfully powered up in bypass mode) further testing accordingto the present invention may be performed.

Before testing die, the integrity of the serially connected dieselectors 161 can be tested. Testing of the die selectors can occur byinjecting clock pulses from PA4 to S1 of the upper left die selector(adjacent die 1) and monitoring S2 of the lower left die selector(adjacent die 64) at PA3. If the serial path between the die selectorsis intact, a clock pulse output will occur on lower left S2 after 65clock pulses have been applied to upper left SI. On the falling edge ofthe first injected clock pulse, die 1 is switched from bypass mode tofunctional mode by the mode output of the associated die selector goinghigh. All other die are forced to remain in bypass mode by their dieselectors' mode outputs being low. Also on the falling edge of the firstinjected clock pulse, the upper left die selector connects its S1 and S2terminals so that subsequent S1 clocks are output on S2. On the risingedge of the second injected clock pulse, die 1 is placed back intobypass mode by its die selector's mode output going low. This secondclock pulse is transferred through the upper left die selector to thenext die selector via the S1 to S2 connection. On the falling edge ofthe second clock pulse, the die 2 selector connects its S1 and S2terminals and switches die 2 from bypass to functional mode by drivingthe mode output high. This process continues on to die 64 and its dieselector. On the rising edge of the 65th injected clock pulse, die 64 isplaced back into the bypass mode by its die selector's mode output goinglow, and the 65th clock pulse is output from S2 to PA3.

Also, during the die selector test the current flow to and/or from thewafer via WV and WG can be monitored during each rising and fallingclock edge to see if the expected current increase and decrease occursas each die transfers in sequence between bypass and functional modes.By sensing the wafer current fluctuations, it is possible to detect whena die that should be selected (i.e. in functional mode) is not selected,which could indicate a defect in the die selector arrangement asdiscussed further below.

The above description illustrates how to test and operate the dieselector path from PA4 to PA3. The same test and operation mode ispossible by clocking S2 of the lower left die selector from PA3 andmonitoring S1 of the upper left die selector at PA4. The die selectormodel of exemplary FIG. 17A and state diagram of exemplary FIG. 17Billustrate die selector operation modes in detail. From FIG. 17B it isseen that the die selector responds to a first received S1 or S2 clockpulse to output mode control (on the falling edge) to place theconnected die in functional mode so that it can be tested. After the dieis tested, a rising edge on the same signal (say S1) causes the testeddie to be placed back into bypass mode and also drives the S1 input ofthe next die selector. On the next successive falling edge the dieassociated with the next die selector is switched into functional modefor testing. And so on.

Exemplary FIGS. 18A-18C illustrate in detail the die selector operationdescribed above. PS1 and PS2 in FIG. 18 are externally accessibleterminals (like PA3 and PA4) for injecting and receiving clock pulses.Note that the die selectors operate bidirectionally as mentioned above.The reason for the bidirectional operation is for fault tolerance, i.e.a broken connection between two die selectors can be tolerated. Anexample of the fault tolerant operation of the die selector is shown inFIGS. 19A-19C. In FIG. 19A an open circuit fault exists between the 2ndand 3rd die selectors. PS1 clock activations can only select die 1 and 2(FIG. 19B). However, PS2 clock activations can select die 5, 4, and 3(FIG. 19C). Thus even with an open circuit the die selector arrangementis able to select and place a given die in functional mode for testing.

Wafers such as shown in FIG. 16A may also be connected in series via theS1/S2 signals to allow selection of die on many wafers as shown in FIG.19D. S2 of the lower left die of wafer 191 is connected, via PA3 ofwafer 191 and external conductor 193 and PA4 of wafer 195, to S1 of theupper left die of wafer 195. An analogous connection also exists betweenwafers 195 and 197. External probe connections at PA4 of wafer 191 andPA3 of wafer 197 permit the die selection scheme described above withrespect to FIGS. 16A-18C to be applied to die on plural wafers.

Exemplary FIGS. 20 and 21 illustrate how to further improve die selectorfault tolerance by the addition of a second pair of I/O terminals S3 andS4 in die selector 201. In FIG. 20A, the S3 and S4 serial connectionpath is shown routed between PA1 and PA2 in the vertical scribe lanes.Separating the S1/S2 (horizontal scribe lanes) and S3/S4 (verticalscribe lanes) routing is not required, and both routings could be in thesame horizontal or vertical lanes if desired. It is clear in the exampleof FIG. 20A that routing S1 and S2 in the horizontal lanes and routingS3 and S4 in the vertical lanes will result in different die selectionorders, i.e. S1 and S2 select die order 1, 2, 3 . . . 64 or die order64, 63, 62 . . . 1, whereas S3 and S4 select die order 1, 16, 17, . . .64 . . . 8 or die order 8, 9, 24 . . . 1.

Exemplary FIGS. 21A and 21B illustrate the model and state diagram ofthe improved fault tolerant die selector 201 of FIGS. 20A and 20B. Theoperation of the die selector 201 of FIG. 21A is similar to that of thedie selector 161 of FIG. 17A except that the die selector 201 hasredundant bidirectional selection paths. Redundant selection paths allowthe die selector 201 to maintain operation even when one of itsselection paths is rendered inoperable by gross defects that defeat thefault tolerance features provided in the single path die selector 161 ofFIG. 17A.

In FIGS. 22A-24C operational examples using dual selection path dieselectors 201 are shown. For clarity, the examples show both paths (S1and S2, and S3 and S4) routed together (in same scribe lanes) to thesame sequence of die 1 through 5. This differs from the example routingof FIG. 20A where S1 and S2 are routed in horizontal lanes and S3 and S4are routed in vertical lanes, and thus each path has a differentsequence of die selection. FIG. 22B shows PS1 selecting die in the order1, 2, 3, 4 & 5. FIG. 22C shows PS2 selecting die in the order 5, 4, 3, 2& 1. FIG. 23A shows PS3 of FIG. 22A redundantly selecting die in thesame order as PS1 (FIG. 22B). FIG. 23B shows PS4 of FIG. 22A redundantlyselecting die in the same order as PS2 (FIG. 22C). Both paths cantolerate a single defect (open circuit) as shown in FIGS. 19A-19C.

However, FIG. 24A shows a multiple defect example (two open circuits) onthe S1 and S2 path that would disable access to intermediate die 2, 3 &4 if only the S1 and S2 path were provided. FIGS. 24B-24C illustratethat PS1 can only select die 1, and PS2 can only select die 5 with thedefects shown in FIG. 24A. However, since redundant selection paths areprovided in the die selectors 201 of FIG. 24A, the S3 and S4 path can beused to select die 2, 3 & 4 as illustrated in FIGS. 23A-23B. Thus anadvantage of die selector 201 is that it can maintain access to die evenif one of the paths is critically disabled by multiple defects.

FIGS. 24F and 24G illustrate an exemplary implementation of the dieselector 161 defined in FIGS. 17A-18C. In FIG. 24F, input terminals S1and S2 are respectively connected to inputs S1IN and S2IN of a dieselector state machine 241 via respective input data buffers 243 and245. The die selector state machine 241 outputs the mode signal andenable signals S1ENA and S2ENA. Enable signals S1ENA and S2ENArespectively control output data buffers 247 and 249. The output ofinput data buffer 243 is connected to the input of output data buffer249 to permit signals received at terminal S1 to be output on terminalS2 when enable signal S2ENA enables output data buffer 249. Similarly,the output of input data buffer 245 is connected to the input of outputdata buffer 247 to permit signals received at terminal S2 to be outputon terminal S1 when enable signal S1ENA enables output data buffer 247.

Exemplary FIG. 24G illustrates the die selector state machine 241 ofFIG. 24F in greater detail. A conventional power-up reset circuitinitially clears D flip-flops 251, 253 and 255 when the die selector isinitially powered up. The pass signal output from flip-flop 255 isinverted at one input of AND gate 259. The other input of AND gate 259,which is driven by the output of OR gate 257, is thus qualified at gate259 by the pass signal upon initial power up. Because flip-flop outputsQS1 and QS2 are low after initial power-up, the mode signal is thereforelow after power-up. Noting that QS1 is connected to S2ENA and QS2 isconnected to S1ENA, it is seen from FIG. 24F that output data buffers247 and 249 are initially disabled after power-up. Because signal QS1 isinitially low, signal S2IN is initially qualified at AND gate 261, andbecause signal QS2 is initially low, signal S1IN is also initiallyqualified at AND gate 263. The low levels of QS1 and QS2 also drive theD input of flip-flop 255 low via OR gate 265. The outputs of AND gates261 and 263 are connected to respective inputs of OR gate 271 whoseoutput drives the clock inputs of flip-flops 251, 253 and 255. Theoutput of AND gate 261 is connected to the D input of flip-flop 253 viadelay element 267, and the output of AND gate 263 is connected to the Dinput of flip-flop 251 via delay element 269. Delay elements 267 and 269are designed to have a propagation delay which is greater than thepropagation delay of OR gate 271.

A rising edge of a first clock pulse on S1 IN causes a logic zero to beclocked through flip-flop 255, thereby maintaining the pass signal atits initial low state. When the falling edge of the clock pulse occursand propagates through OR gate 271 to clock flip-flop 251, the D inputof flip-flop 251 will still be high due to the delay element 269, thuscausing flip-flop output QS1 to go high. With QS1 high, the mode signalis driven high via OR gate 257 and AND gate 259. Also with QS1 high, theoutput data buffer 249 of FIG. 24F is enabled via signal S2ENA, theinput S2IN is disqualified at AND gate 261, and the D input of flip-flop255 is driven high via OR gate 265. Thus, the rising edge of the secondclock pulse on terminal S1 of FIG. 24F passes directly to terminal S2via output data buffer 249, and also passes through AND gate 263 and ORgate 271 of FIG. 24G to clock flip-flop 255 and take the pass outputthereof high, thereby driving the mode signal low. The next falling edgeon terminal S1 will pass through data output buffer 249 to terminal S2,and will maintain the QS1 output of flip-flop 251 in the high logicstate. The positive edge of the third clock pulse received on terminalS1 will pass through data output buffer 249 to terminal S2, and willalso clock a logic one through flip-flop 255 so that the pass signalwill maintain the mode output low via AND gate 259. The negative edge ofthe third clock pulse will maintain the logic one at the QS1 output offlip-flop 255. Each successive clock pulse after the third clock pulseon terminal S1 will achieve the same results as described with respectto the third clock pulse.

The bidirectional feature of die selector 161 should be apparent fromFIGS. 24F and 24G. That is, if a succession of clock pulses had occurredon terminal S2 rather than on terminal S1, then output QS2 of flip-flop253 would have been driven high to enable data output buffer 247 anddisable the S1IN signal via AND gate 263. The mode signal behavesexactly the same in response to a succession of clock pulses on terminalS2 as described above with respect to the succession of clock pulses onterminal S1, and the terminal S1 will receive the second and allsuccessive clock pulses input on terminal S2.

Exemplary FIGS. 24D and 24E show an implementation of die selector 201which is similar to the implementation of die selector 161 illustratedin FIGS. 24F and 24G. Referencing FIG. 24D, the output of data inputbuffer 243 is connected to the input of data output buffer 249 as inFIG. 24F, and the output of data input buffer 245 is connected to theinput of data output buffer 247 as in. FIG. 24F. Similarly, the outputof data input buffer 275 is connected to the input of data output buffer277, and the output of data input buffer 281 is connected to the inputof data output buffer 279.

The die selector state machine 273 of FIG. 24D is shown in greaterdetail in FIG. 24E. As seen from FIG. 24E, the die selector statemachine 273 of FIG. 24D represents an extension of the die selectorstate machine of 241 of FIG. 24G. An additional AND gate 287, delayelement 293, and flip-flop 283 have been added for terminal S3, and anadditional AND gate 289, delay element 291 and flip-flop 285 have beenadded for terminal S4. The operation of these additional elements isidentical to the operation described above with respect to thecorresponding elements in FIG. 24G. Similarly to the operation describedabove with reference to FIG. 24G, a first falling clock pulse edge onterminal S3 will result in the QS3 output of flip-flop 283 going high todrive the mode signal high and to enable the data output buffer 277 toconnect terminal S3 to terminal S4. The rising edge of the second clockpulse on terminal S3 will clock a logic one through flip-flop 255 sothat the pass signal will drive the mode signal low again via AND gate259. Similarly, the falling edge of a first clock pulse on terminal S4will drive high the QS4 output of flip-flop 285, which drives the modesignal high and enables data output buffer 279 to connect terminal S4 toterminal S3. The decoder circuit 291 receives QS1-QS4 as inputs andprovides DS1-DS4 as outputs. When QS1 is active high, the decodercircuit 291 drives DS2-DS4 active high, which disables signals S2IN,S3IN and S4IN at AND gates 261, 287 and 289. Similarly, when signal QS2is active high, the decoder circuit drives signals DS1, DS3 and DS4active high, when signal QS3, is active high, the decoder circuit drivessignals DS1, DS2 and DS4 active high, and when QS4 is active high, thedecoder circuit drives signals DS1-DS3 active high.

Referencing exemplary FIGS. 25A and 25D, probe test pads in PA1 arebussed (via A-Bus) to one side of eight top column switch groups(TC1-8), representative switch group TC8 being shown in FIG. 25D. Eachtop column switch group also receives a select top column signal (suchas STC8) from PA1 that opens or closes the switches. The other side ofeach top column switch group is bussed to the A side (recall FIG. 5)pads of die 1,2, 3,4, 5, 6, 7, and 8.

Also referencing FIG. 25C, probe test pads in PA2 are bussed (via B-Bus)to one side of eight right row switch groups (RR1-8), representativeswitch group RR8 being shown in FIG. 25C. Each right row switch groupalso receives a select right row signal (such as SRR8) from PA2 thatopens or closes the switches. The other side of each right row switchgroup is bussed to the B side pads of die 8, 9, 24, 25, 40, 41, 56, and57.

Referencing also FIG. 25E, probe test pads in PA3 are bussed (via C-Bus)to one side of eight bottom column switch groups (BC1-8), representativeswitch group BC1 being shown in FIG. 25E. Each bottom column switchgroup also receives a select bottom column signal (such as SBC1) fromPA3 that opens or closes the switches. The other side of each bottomcolumn switch group is bussed to the C side pads of die 57, 58, 59, 60,61, 62, 63, and 64.

Referencing also FIG. 25B, probe test pads in PA4 are bussed (via D-Bus)to one side of eight left row switch groups (LR1-8), representativeswitch group LR1 being shown in FIG. 25B. Each left row switch groupalso receives a select left row signal (such as SLR1) from PA4 thatopens or closes the switches. The other side of each left row switchgroup is bussed to the D side pads of die 1, 16, 17, 32, 33, 48, 49, and64.

PA1-4, the switch groups, and bussing to correct them can all be locatedin the unusable peripheral area (recall FIG. 3A) of the wafer.

As shown in the detailed example of FIG. 26, each die on the wafer,excluding the boundary die, such as die 1, 2, 3, 16, 17 etc. isconnected at its top (A), right (B), bottom (C) and left (D) side padsites to neighboring die pad sites by way of short busses that bridgeacross the scribe lanes between the die. Due to the regularity of thedie and their positioning on the wafer, vertical pad bussing is providedbetween each neighboring die on sides A and C, and horizontal padbussing is provided between each neighboring die on sides B and D. Thepads of boundary die are similarly bussed to neighboring die pads, butonly on at most three sides, since at least one of the boundary diesides will always be connected to a switch group.

Although not shown in FIG. 25A, the wafer also comprises: (1) die havingselectable functional and bypass modes as described in FIGS. 5-14, (2)WV and WG bussing as shown in FIGS. 15A-15B, and (3) fault tolerant dieselectors as described in FIGS. 16-24.

Each switch group, when selected (switches closed), provides a lowimpedance, bidirectional signaling path. Also the bussing connectionsbetween PA1-4 and the switch groups (TC1-8, LR1-8, BC1-8, RR1-8),between the switch groups and the die sides (A, B, C, D), and betweenthe die sides, provide a low impedance, bidirectional signaling path. Aspreviously mentioned, the die's internal bypass pad-to-pad connectionsalso provide low impedance, bidirectional signaling paths.

When testing is to be performed, a probe is positioned onto the wafer atthe pad areas PA1-4. PA1-4 are large compared to the pad area of eachdie, and therefore the mechanical requirements of the probe design aresimpler ad less costly than conventional probes which are elegantlydesigned for contacting tiny die pads. Also, since the present inventionallows for a die to be electronically selected for testing, the probeneeds to be positioned onto the wafer only once, which reduces test timewhen compared to conventional multiple probing of a wafer. This testtime reduction can significantly decrease the cost of wafer testing,which in turn decreases the cost of the die and packaged IC. Also, sincethe probe does not contact any die pads, no damage to die pads occursduring the wafer probe and die test procedure. Furthermore, therelatively large probe target area provided by PA1-4 lends itself wellto computer controlled and automated test probing processes.

After the probe contacts the wafer at PA1-4, power is applied to thewafer to power up the die and die selectors. The tester can quicklydetect a high current situation and remove power from the wafer asnecessary. Wafer processing faults could cause shorts between WG and WVbussing or a die or die selector could have a V and G short. If thewafer fails the high current test at power up, die testing can still bedone by conventional die probing techniques.

If the wafer exhibits normal current flow at power up, the die selectorscan be tested as previously described with regard to FIGS. 16-24. If thedie selectors fail in all fault tolerant modes, the wafer can still betested conventionally. If the die selectors pass, the row and columnbussing paths can be tested. To test row 1 and column 1 (FIGS. 25 and26), the LR1, RR1, TC1 and BC1 switch groups are closed and, with alldie in bypass mode, an external tester (such as in FIG. 4) passessignals between PA4 and PA2 to test row 1 bussing and between PA1 andPA3 to test column 1 bussing. This step tests, (1) the PA1-4 to switchgroup bussing, (2) the switch group closures, (3) the switch group toboundary die bussing, (4) the die bypass mode, and (5) the die-to-diepad bussing. This step is repeated on all rows and columns. If a row orcolumn fails, die associated with that row and column can be testedconventionally. After testing row and column connectivity, the die canbe tested.

The die test starts by outputting a first pulse to S1 (could be S2, orS3 or S4 if die selector 201 is used) from PA4 to cause the upper leftdie selector to switch die 1 from bypass to functional mode, and thenclosing switch groups LR1, TC1, RR1 and BC1, and then testing die 1using the external tester which is connected to die 1 via PA1-4, theclosed switch groups and the row 1 and column 1 bussing paths. This testsequence is repeated on all die on the wafer. FIG. 26 illustrates indetail the testing of die 15 via the row 2 and column 2 bussing paths.Different types of testing can be performed on a selected die. A firsttest is a DC test where the objective is to verify the I/O parametricsand the logical correctness of the die. A second test is a functionaltest wherein the die is functionally tested at its intended operatingspeed. Some high reliability applications require an environmental (orburn in) test where the die is tested in chambers where temperature,humidity, and vibration can be cycled during testing. Die that pass DCtesting may fail functional and environmental testing, so at wafer levelit is important to test die in DC, functional, and perhaps environmentaltest mode to prevent bad die from being packaged into IC form orassembled on MCMs.

To perform die testing, it is important to provide relatively highperformance bussing paths, i.e. all the wafer routed bussing, the diebypass mode pad-to-pad connectivity bussing, and the switch groupswitches are preferably designed for low impedance and bidirectionalsignaling. In the die 15 test example of FIG. 26, the D and A sides ofdie 15 receive test signaling from PA4 and PA1 through only bypassed die16 and 2 respectively, whereas test signaling at sides B and C of die 15must traverse more than one bypassed die (see FIG. 25A) before arrivingfrom PA2 and PA3, respectively. The die bypass signaling delay anddie-to-die bussing delays can easily be modeled in tester software sothat the tester can compensate for the delays through row and columnbussing paths that traverse different numbers of die in bypass mode. Inthis way, test signaling between the tester and target die under testwill occur correctly, independent of the number of bypassed die thatexists in the row and column bussing paths connected to the A, B, C, andD sides of the die under test.

In exemplary FIG. 27, a wafer bussing structure is shown where each rowand column has its own pair of probe areas. For example probe area leftrow 1 (PALR1) and probe area right row 1 (PARR1) serve as the row 1probe areas, and probe area top column 1 (PATC1) and probe area bottomcolumn 1 (PABC1) serve as the column 1 probe areas. The die-to-diebussing is the same as described previously relative to FIGS. 25-26.Also the probe areas can exist in the unused peripheral area of thewafer. Optionally, the probe areas could be eliminated altogether andthe pad sites at the A, B, C and D sides of the top, right, bottom, andleft boundary die could be probed if desired. FIG. 28 illustrates anexample of how each row can be supplied, via its left and right probeareas PALRn and PARRn, with a unique V and G connection. FIG. 29illustrates how each row can be supplied, via its left and right probeareas PALRn and PARRn, with a unique die selector signaling connection.The power and die selector connections could also be arrangedcolumn-wise so that PATCn and PABCn would provide each column withunique power supply and die selection.

Exemplary FIG. 30 illustrates in detail how diagonally positioned die17, 15, and 3 are tested in parallel. If a group of diagonallypositioned die are placed in functional mode (via each row'sindependently operated die selectors of FIG. 29) while all other die arein bypass mode, then further test time reduction can be achieved byparallel (i.e. simultaneous) testing of the group of diagonallypositioned die via the dedicated row and column bussing paths and probeareas shown in FIG. 30. FIGS. 31A through 31O illustrate the paralleldie testing approach as it proceeds across all groups of diagonallypositioned die on the wafer. These steps of parallel die testing arelisted below, using the die numbering of FIG. 27.

Step 1—Select and Test die 1 (FIG. 31A).

Step 2—Select and Test die 16 and 2 (FIG. 31B).

Step 3—Select and Test die 17, 15, and 3 (FIG. 31C).

Step 4—Select and Test die 32, 18, 14, and 4 (FIG. 3D).

Step 5—Select and Test die 33, 31, 19, 13, and 5 (FIG. 3 E).

Step 6—Select and Test die 48, 34, 30, 20, 12, and 6 (FIG. 31F).

Step 7—Select and Test die 49, 47, 35, 29, 21, 11, and 7 (FIG. 31G).

Step 8—Select and Test die 64, 50, 46, 36, 28, 22, 10, and 8 (FIG. 31H).

Step 9—Select and Test die 63, 51, 45, 37, 27, 23, and 9 (FIG. 311).

Step 10—Select and Test die 62, 52, 44, 38, 26, and 24 (FIG. 31J).

Step 11—Select and Test die 61, 53, 43, 39, and 25 (FIG. 31K).

Step 12—Select and Test die 60, 54, 42, and 40 (FIG. 31L).

Step 13—Select and Test die 59, 55, and 41 (FIG. 31M).

Step 14—Select and Test die 58 and 56 (FIG. 31N).

Step 15—Select and Test die 57 (FIG. 310).

The foregoing die test sequence notwithstanding, the die can be groupedas desired for parallel testing, so long as each die of the group is rowand column accessible independently of all other die of the group. Asanother example, and using the die numbering of FIG. 27, each of thefollowing eight die groups can be tested in parallel to achieve aneight-step test sequence.

Step 1—Select and Test die 1, 9, 23, 27, 37, 45, 51 and 63.

Step 2—Select and Test die 2, 16, 24, 26, 38, 44, 52 and 62.

Step 3—Select and Test die 3, 15, 17, 25, 39, 43, 53 and 61.

Step 4—Select and Test die 4, 14, 18, 32, 40, 42, 54 and 60.

Step 5—Select and Test die 5, 13, 19, 31, 33, 41, 55 and 59.

Step 6—Select and Test die 6, 12, 20, 30, 34, 48, 56 and 58.

Step 7—Select and Test die 7, 11, 21, 29, 35, 47, 49 and 57.

Step 8—Select and Test die 8, 10, 22, 28, 36, 46, 50 and 64.

The above-described parallel testing of die on wafer can reduce wafertest time as compared to individual, sequential testing of die on wafer.

The present invention is also applicable to IDDQ testing of each die onthe wafer. IDDQ testing is the monitoring of current to an IC/die duringthe application of test patterns. A higher than expected current at aparticular test pattern may indicate a defect. The WV and WG bussingarrangement of FIG. 15A is adequate when performing IDDQ testing in theone-die-at-a-time arrangement of FIGS. 25-26, because any unexpectedcurrent on WV and/or WG can be attributed to the one die that is infunctional mode. As to the parallel die testing arrangement of FIGS.30-31, row-specific V and G bussing of the type shown in FIG. 28 permitsunexpected V and G current to be attributed to the correct die of thediagonal grouping being tested. If this capability is not desired in thetest arrangement of FIGS. 30-31, then the WV and WG bussing of the typeshown in FIG. 15A can be used in FIGS. 30-31. For example, an additionalprobe access area could be provided for power supply bussing, in whichcase PALRn and PARRn need not provide power.

As mentioned above, the present invention permits the tester probedesign to be greatly simplified relative to prior art designs, resultingin less expensive testers. Thus, even the IC vendor's customers canafford to maintain their own wafer tester. This permits the vendor tosell complete wafers (rather than singulated die) to customers, who canthen repeat the vendor's wafer test and verify the results, and thenadvantageously singulate the die for themselves. The vendor is thusrelieved of the risk of damaging die during singulation, while thecustomers can advantageously obtain unpackaged die (on wafer), verifythat the die have not been damaged in transit from the vendor, and thensingulate the die themselves.

Although exemplary embodiments of the present invention are describedabove, this description does not limit the scope of the invention, whichcan be practiced in a variety of embodiments.

1. An integrated circuit comprising: A. a rectangular substrate; B.functional core logic, formed on the substrate, for performing normaloperating functions of the integrated circuit; C. plural bond padsformed adjacent the four peripheral sides of the substrate; D. firstleads extending from each bond pad; E. second conductors extendingacross the substrate to opposite sides, the second conductors beingelectrically separate from one another and the functional core logic;and F. switch means connected to the first leads, to the functional corelogic, and to the second conductors, the switch means for selectivelyconnecting the first leads to the functional core logic and isolatingthe first leads from the second conductors, and the switch means forselectively connecting the first leads to the second conductors toprovide bi-directional connections between the bond pads on oppositesides of the substrate and isolating the first leads from the functionalcore logic.
 2. The integrated circuit of claim 1 in which the bond padson opposite sides of the substrate are generally paired with the bondpads on the opposite side of the substrate, and each second conductorextends between each pair of bond pads.
 3. The integrated circuit ofclaim 1 in which the second conductors between opposing sides presentsubstantially the same propagation delay.
 4. The integrated circuit ofclaim 1 in which the switch means include a mode lead receiving a modesignal indicating the selective connections of the first lead,functional core logic and second conductors.